ASM – Front End Equipment
About ASM
ASM International N.V. is a leading supplier of semiconductor process equipment in both front- and back-end markets. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network.
Each of ASM International’s major products are qualified for 300mm wafer processing, the wafer size of the future. This and other leading-edge process and equipment developments ensure ASM International a position of strength and growth for many years.
ASM Pacific Technology Ltd. is the world’s largest assembly and packaging equipment supplier for the semiconductor industry. Listed in Hong Kong since 1989 (ASMPT), ASM Pacific Technology Ltd. is 54% owned by ASM International N.V., a NASDAQ listed supplier of wafer processing equipment.
ASM Pacific Technology Ltd. with headquarters in Hong Kong has operations in Shenzhen, China, Singapore and Malaysia. We are a leading supplier of a full line of assembly and packaging equipment and process solutions for the semiconductor, photonics and optoelectronics industries. Our financial strength and R&D resources allow us to provide customers with total solutions, process innovation, package development and factory automation.
Visit http://www.asm.com and http://www.asmpacific.com
ASM – FRONT END EQUIPMENT
Process and Applications:
Oxidation ,Anneal ,Undoped and in-situ (P, As, B) doped polysilicon, Amorphous silicon, Poly SiGe, HSG, TEOS, SiN, HTO, Oxynitride, ALCVD: Al2O3, Ta2O5, HfO2 and their nanolaminates, TiN, Low temperature nitride and oxide < 550 oC (BTBAS), Plasma Enhanced Process Capability, Nanodots / SONOS, Very low temperature nitride and oxide < 450 oC (Silcore based).
CMOS, MEMS, Low-k dielectrics, Hardmask SiC k < 4.0, Hardmask SiN, Carbon Polymer.
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